Index of /h96max/pn63/Downloads-1/Downloads

[ICO]NameLast modifiedSizeDescription
[PARENTDIR]Parent Directory  -  
[DIR]IEDM_template_LaTeX/2025-07-03 10:36 -  
[DIR]P63851EP-DE_2024_11_04_02_50_19[12]/2025-07-03 10:36 -  
[DIR]untitled folder/2025-07-03 10:36 -  
[DIR]Abstract submissions/2025-07-03 10:36 -  
[ ]ELECTENGR-2024-09-26-20-35-35.pdf2024-11-04 21:40 470K 
[ ]113???C0710.xls2024-11-04 21:32 57K 
[ ]111??????1110817.xls2024-11-04 21:21 76K 
[ ]112???1130306E.xls2024-11-04 21:21 76K 
[ ]113???E0710.xls2024-11-04 21:21 68K 
[ ]ACiM VLSI SSCL 2024 double column v1.pdf (1).pdf2024-11-03 08:06 3.3M 
[ ]movies.zip2024-10-20 18:49 303M 
[ ]photos.zip2024-10-20 18:49 72M 
[ ]Brett Murdock_FINAL_Mobile_2024 (1).pdf2024-10-09 13:45 848K 
[ ]70th Annual International Electron Device Meeting.pdf2024-10-09 09:46 967K 
[ ]Brett Murdock_FINAL_Mobile_2024.pdf2024-10-09 08:55 848K 
[ ]JESD401-5B.01.pdf2024-10-09 07:27 1.1M 
[ ]JESD318.pdf2024-10-09 07:26 3.9M 
[ ]PS-007A.pdf2024-10-09 07:26 4.7M 
[ ]JESD209-5C.pdf2024-10-09 07:26 13M 
[ ]JESD406-5_0.pdf2024-10-09 07:26 1.1M 
[ ]Intel-Samsung Meeting 2024-10-03, inc. Cost and Model.pdf2024-10-04 07:10 2.5M 
[TXT]TMC-LPW Planning.html2024-09-28 07:47 725K 
[ ]us-cpm-application-program-package.pdf2024-09-25 05:01 282K 
[TXT]Upcoming Appointment.ics2024-09-24 10:26 741  
[ ]e85db671-458f-4756-8bd2-7a235174bec8.pdf2024-09-18 08:15 134K 
[ ]tg423b3^20240726^1833.98^SKhynix^JESDxxx_tv1.03_wip_20240726_0.72.pdf2024-09-17 08:55 7.4M 
[TXT]cupertino-ca.html2024-09-15 03:32 44K 
[ ]Sk hynix Custom Memory Solutions_20240103 (1).pdf2024-09-15 01:53 4.8M 
[ ]Sep24 Retirement.xlsx2024-09-14 05:14 17K 
[ ]~$Sep24 Retirement.xlsx2024-09-14 05:12 165  
[ ]Samsung_Low Latency Wide IO_Specification_Target_r00.pdf2024-09-14 04:53 1.3M 
[ ]Sk hynix Custom Memory Solutions_20240103.pdf2024-09-14 02:02 4.4M 
[ ]RE- TMC-LPW Dimi-DerChang 1-1 .msg2024-09-13 14:29 13K 
[TXT]Book1.txt2024-09-13 05:57 1.6K 
[ ]FINAL_Hung_Vuong_Automotive_forum-memory technologies.pdf2024-09-11 11:29 1.4M 
[ ]LPDDR energy Mickey_Choi_FINAL_2024.pdf2024-09-11 11:26 1.1M 
[ ]1 - Planning and Development UPLC Requirements_3.0.0.xlsx2024-09-11 06:57 80K 
[ ]2 - Planning and Development UPLC Overview_3.0.0.pptx2024-09-11 06:57 3.8M 
[ ]level.pptx2024-09-10 04:17 595K 
[ ]TSV-based Stacked Silicon Capacitor with Embedded Package Platform ECTC 2023.pdf2024-09-10 02:56 555K 
[ ]Power_Integrity_Performance_Gain_of_a_Novel_Integrated_Stack_Capacitor_ISC_Solution_for_High-end_Computing_Applications.pdf2024-09-10 02:53 665K 
[ ]MySessions971628.xlsx2024-09-08 05:28 3.0K 
[ ]MySessions97148.xlsx2024-09-08 03:08 3.0K 
[ ]Pages from 10857 Linda Vista Preliminary Consultation (1).pdf2024-09-06 12:58 1.1M 
[ ]Pages from 10857 Linda Vista Preliminary Consultation.pdf2024-09-06 12:55 1.1M 
[ ]ACiM VLSI SSCL 2024 double column v1.pdf.pdf2024-09-06 02:05 3.3M 
[ ]Builders? Remedy.pdf2024-09-05 00:25 35K 
[ ]~$Book1.xlsx2024-09-04 08:37 165  
[ ]Book1.xlsx2024-09-03 08:47 11K 
[ ]SJC to Home.pdf2024-08-31 00:07 175K 
[ ]Hilton to MCD.pdf2024-08-31 00:06 157K 
[ ]MCD to Hilton.pdf2024-08-30 23:38 159K 
[ ]blank.pptx2024-08-29 03:43 32K 
[ ]~$blank.pptx2024-08-29 03:43 165  
[ ]FOLIODETE_20240827090938.pdf2024-08-29 01:12 71K 
[ ]EventList (2).xlsx2024-08-27 04:07 3.6K 
[ ]sc_cart_item_0a76a7acc3d8921001e2fedc7a01314d_attachments.zip2024-08-26 01:18 121K 
[ ]American Express - Activity Statement.pdf2024-08-26 01:17 150K 
[ ]radk3eh0gvy.xlsx2024-08-24 15:22 25K 
[ ]Copy of Book1.xlsx2024-08-24 05:47 14K 
[ ]IEDM2004-2067.pdf2024-08-23 05:36 1.5M 
[ ]IEDM2004-2080.pdf2024-08-23 05:36 814K 
[ ]IEDM2004-2083.pdf2024-08-23 05:35 756K 
[ ]rad5eruqzpk.xlsx2024-08-22 09:10 25K 
[ ]Team Jack iedm24 LN.pdf2024-08-22 09:09 6.7M 
[ ]rad1tfb2prj.pdf2024-08-22 04:59 774K 
[ ]radfcc50vue.xlsx2024-08-21 07:18 24K 
[ ]radf5jjody2.xlsx2024-08-21 07:17 24K 
[ ]FSII AI Memory.pdf2024-08-21 02:01 3.9M 
[ ]RadGridExport.xlsx2024-08-20 13:27 4.2K 
[ ]ChairHome.aspx2024-08-20 09:27 30K 
[ ]rad3lmnid2o.xlsx2024-08-20 09:19 9.6K 
[ ]MySessions819203.xlsx2024-08-20 09:03 1.9K 
[ ]Technology options for modular VR.pptx2024-08-20 06:58 41K 
[ ]T8.1 Highly Scalable Vertical Bypass RRAM (VB-RRAM) for 3D V-NAND Memory.pdf2024-08-18 06:17 1.7M 
[ ]T8-1 Highly Scalable Vertical Bypass RRAM (VB-RRAM) for 3D V-NAND Memory.pdf2024-08-18 06:15 2.7M 
[TXT]chiplets-and-advanced-packaging-moving-the-industry-forward.ics2024-08-14 02:12 810  
[ ]s41467-023-41643-6.pdf2024-08-13 08:33 3.0M 
[ ]DTTC24__1721948227DTTC_2024_Embedding_of_SRAM_chiplets_disaggregation_final.pdf2024-08-13 05:56 1.3M 
[ ]IMS Abstract Submission Grading Sheet 2024_Final 7 - 0728.xlsx2024-08-08 00:30 71K 
[ ]IMS Abstract Submission Grading Sheet 2024_Final 7 - 0726-1216.xlsx2024-08-08 00:24 71K 
[ ]~$dram_for_gpus_talk.pptx2024-08-07 14:26 165  
[ ]dram_for_gpus_talk.pptx2024-08-07 14:26 5.2M 
[ ]Execs Aug 2024.xlsx2024-08-07 00:19 65K 
[ ]us-separation-payment-estimate-tool.xlsx2024-08-06 06:26 29K 
[ ]us-enhanced-retirement-calculator.xlsx2024-08-06 03:09 26K 
[ ]radv5ulsvsw.xlsx2024-08-03 02:34 9.4K 
[ ]IEDM2024-000131.pdf2024-08-03 01:49 1.1M 
[ ]tg423b3^20240726^1833.98^SKhynix^JESDxxx_tv1.03_wip_20240726_0.72_red.pdf2024-08-01 07:05 7.4M 
[ ]~$IMS Abstract Submission Grading Sheet 2024_Final 7 - 0726-1216.xlsx2024-08-01 00:11 165  
[ ]IMS Abstract Submission Grading Sheet 2024_Final 7.xlsx2024-07-27 03:14 71K 
[ ]Cu-TSV Resistivity.pdf2024-07-26 09:40 2.1M 
[ ]intel-64-architecture-processor-topology-enumeration.pdf2024-07-26 05:00 331K 
[ ]OneDrive_2024-07-25.zip2024-07-26 01:50 7.2M 
[ ]~$IMS Abstract Submission Grading Sheet 2024_Final 7.15.xlsx2024-07-26 01:45 165  
[ ]IMS Abstract Submission Grading Sheet 2024_Final 7.15.xlsx2024-07-25 10:12 71K 
[ ]~$rad5kggwkdm.xlsx2024-07-24 06:33 165  
[ ]The Bonnet Creek Resorts Reservation Confirmation.pdf2024-07-15 07:50 108K 
[ ]~$TOP500_202406.xlsx2024-07-13 10:49 165  
[ ]DTTC_printable_schedule_7-8-2024.pdf2024-07-09 02:00 826K 
[ ]TI DRAM Market Report Q2 2024.xlsx2024-07-03 02:23 1.4M 
[VID]01636_countdown_film_clutter_02_-_wwwcutestockfootagecom (Original).mp42024-07-01 03:02 13M 
[ ]Samsung summary from FTE 06-06-24 v1.pptx2024-06-28 09:23 10M 
[ ]125.pdf2024-06-28 01:57 354K 
[ ]history-1985-annual-report.pdf2024-06-27 13:11 20M 
[IMG]omutlu-cmu.jpg2024-06-27 08:25 262K 
[ ]2024-Apr-05 SF2 FIP Offering_V0.9DK.pdf2024-06-27 05:26 441K 
[ ]2023-Aug-11 Intel-Samsung meeting on SF2 Tech.pdf2024-06-27 05:26 790K 
[ ]2024-01031 Intel_SF2_vs_4LPP_Performance_240201.pdf2024-06-27 05:26 800K 
[IMG]Wuu-390-1.jpg2024-06-26 13:03 2.0M 
[ ]1fbd1e17-1c22-41ed-b087-6831d635a518 (1).pptx2024-06-26 08:43 9.4M 
[ ]IEDM24_publications_June_v2.pptx2024-06-25 22:53 339K 
[ ]9781119313984.epub2024-06-22 00:47 71M 
[ ]tg423b3^20240403^x^SKhynix^HBM4 Mechanical Test Vehicle Design Requirements_rev03.pdf2024-06-21 09:28 1.9M 
[ ]978-3-030-50743-5.epub2024-06-19 13:10 36M 
[ ]SHARP NV-Switch.pdf2024-06-19 13:06 1.6M 
[ ]JC-42.22 20240604 1883.98 SKhynix HBM4 Full Spec draft R0.71.pdf2024-06-18 03:53 6.6M 
[ ]JC422^20240604^1883.98^SKhynix^HBM4 Full Specification draft_tv1.00_wip_20240604_0.71_clean.pdf2024-06-17 23:52 7.2M 
[ ]RF Modeling and Charx of TSVs.pdf2024-06-13 11:46 1.3M 
[ ]GEMS 2024 Poster Roadshow.pdf2024-06-13 02:52 27M 
[ ]20240213_WIDE IO Solution review_intel.pdf2024-06-13 01:44 1.0M 
[ ]Samsung-Intel HBM4 z-height discussion.pdf2024-06-13 00:33 543K 
[ ]23ww25a_Intel_Feedback_Samsung_HBM4_Bump_Pattern.pdf2024-06-13 00:31 1.1M 
[ ]~$t-travel-approval-form.docx2024-06-12 06:02 162  
[ ]elt-travel-approval-form.docx2024-06-12 06:02 22K 
[ ]ELT Travel Exception Form - Request 23154.doc2024-06-12 05:15 224K 
[ ]PE Pipe App Form April2024.docx2024-06-08 00:52 46K 
[ ]SF2 milestone for Intel (0208) - r4.pdf2024-06-06 11:24 789K 
[ ]SF2 FIP Offering_V0.9DK (Apr 2024) (1).pdf2024-06-06 10:34 480K 
[ ]SF2 FIP Offering_V0.9DK (Apr 2024).pdf2024-06-06 10:29 480K 
[ ]24WW23 UT_Austin_Kulkarni_3DHI_v2.pdf2024-06-05 22:16 5.5M 
[ ]20240603 - FTE Ops - Computex 24 Highlights.pptx2024-06-05 09:01 18M 
[ ]VFO in ECTC24.pdf2024-06-05 07:18 1.0M 
[ ]A_noble_VFOVertical_wire_Fan_Out_technology_for_small_form_factor_and_high_performance_memory_applications.pdf2024-06-05 07:17 768K 
[ ]Exec Sync F2F 1H 2024_Share.pdf2024-05-29 02:37 6.7M 
[ ]Workshop (1).pdf2024-05-24 05:56 272K 
[ ]Workshop.pdf2024-05-24 05:55 272K 
[ ]Fellows Connect Presentation Arrow Lake.pptx2024-05-21 04:16 1.8M 
[ ]FOLIODETE_20240416063342.pdf2024-05-17 06:55 77K 
[ ]gaudi-3-ai-accelerator-white-paper.pdf2024-05-17 04:16 1.9M 
[ ]TOP500_202406 (7).xlsx2024-05-14 07:57 124K 
[ ]TOP500_202406 (6).xlsx2024-05-14 07:57 124K 
[ ]TOP500_202406 (5).xlsx2024-05-14 07:57 124K 
[ ]TOP500_202406 (4).xlsx2024-05-14 07:57 124K 
[ ]TOP500_202406 (3).xlsx2024-05-14 07:57 124K 
[ ]TOP500_202406 (2).xlsx2024-05-14 07:57 124K 
[ ]TOP500_202406 (1).xlsx2024-05-14 07:57 124K 
[ ]TOP500_202406.xlsx2024-05-14 06:02 124K 
[ ]FTiP_i360.pptx2024-05-08 09:39 3.6M 
[ ]PIM 1 HC35_SKhynix_DSM_YongkeeKwon_Memory-centric Computing with SK Hynix?s Domain-Specific Memory.pdf2024-05-07 03:01 18M 
[ ]ubc_2013_fall_zargaranyazd_arash.pdf2024-05-06 08:29 9.9M 
[ ]digital-communication-proakis-salehi-5th-edition.pdf2024-05-04 05:43 25M 
[ ]air-shuttle-flight-schedule (2).xlsx2024-05-03 08:11 25K 
[ ]air-shuttle-flight-schedule-april-may (1).xlsx2024-05-03 08:09 16K 
[ ]P858 PCCB WHITE PAPER.doc2024-05-03 06:43 103K 
[ ]1251 PM2 introduction WP.eml2024-05-03 06:38 486K 
[ ]~$DM_submission_paper-template_2020.docx2024-05-02 06:37 162  
[ ]IEDM_submission_paper-template_2020.docx2024-05-02 06:36 2.6M 
[ ]IEDM_template_LaTeX.zip2024-05-02 06:34 190K 
[ ]1481.pdf2024-04-24 13:57 542K 
[ ]SWA SJC-MCO CONF 3CN37Q 497.97.pdf2024-04-24 00:47 193K 
[ ]air-shuttle-flight-schedule-april-may.xlsx2024-04-23 07:28 16K 
[ ]Samsung Technology Update 08-18-2021(SECURED).pdf2024-04-23 04:48 1.5M 
[ ]3nm_GAA Samsung_IEDM 2018.pdf2024-04-23 04:46 584K 
[ ]CCG_CBG Org Chart.pdf2024-04-23 04:42 82K 
[ ]CCG_Global Ops_OrgChart.pdf2024-04-23 04:40 116K 
[ ]CCG_CPPO_Org_Chart.pdf2024-04-23 04:39 75K 
[ ]CCG_CPE_Org Chart.pdf2024-04-23 04:36 173K 
[ ]CCG_CPAD_Org Chart.pdf2024-04-23 04:34 78K 
[ ]CCG_GPU IP, CGAI Org Chart.pdf2024-04-23 04:32 145K 
[ ]Where DEGers go.pptx2024-04-22 09:25 618K 
[ ]GD0001474.pdf2024-04-15 21:42 11M 
[ ]check-in-confirmation.pdf2024-04-11 08:32 208K 
[TXT]dram-advanced-memory-essentials-ame-annual-seminar.ics2024-04-09 04:47 611  
[ ]design-rules-accurate-enthalpy-prediction-and-synthesis-of-stoichiometric-eu3-quantum-memory-candidates.pdf2024-04-06 09:14 5.2M 
[ ]onur-IICS-Keynote-MemoryCentricComputing-February-9-2022.pptx2024-04-06 06:38 152M 
[ ]Advanced Memory Technology RFI.pdf2024-04-06 01:33 889K 
[TXT]Finalize EtOH agenda and invitation - Attendance report 4-04-24.csv2024-04-05 08:58 4.7K 
[ ]Webex Installer.dmg2024-04-05 08:31 4.2M 
[ ]Samsung_CXL_PNM_nskim_gajh (8) (002).pdf2024-03-30 02:19 5.5M 
[ ]CfP _ 2024 IEDM _ ALT[67].docx2024-03-30 00:44 21K 
[ ]2_MB_Array-Level_Demonstration_of_STT-MRAM_Process_and_Performance_Towards_L4_Cache_Applications.pdf2024-03-30 00:36 2.0M 
[ ]SPPD Photonics Update EPAE Review 2024 03 27.pdf2024-03-28 03:10 2.0M 
[IMG]FpApe_kXoAIxMmM (1).jfif2024-03-28 01:49 292K 
[IMG]FpApe_kXoAIxMmM.jfif2024-03-28 01:49 292K 
[TXT]EtOH Prep - Attendance report 3-25-24.csv2024-03-26 07:58 4.4K 
[ ][whitepaper] Computational Memory Solution - Smarter Memory to Enhacne Data Analytics System_rv.pdf2024-03-20 15:30 1.2M 
[ ]SK hynix_LPDDR_LPDDR5_240320.xlsx2024-03-20 15:28 9.3K 
[ ]Shigeki Tomishima Bio 2024.docx2024-03-19 09:30 15K 
[TXT]transcript (2).txt2024-03-19 05:52 1.1K 
[TXT]transcript (1).txt2024-03-19 05:35 1.0K 
[ ]TI Semiconductor Forecast - March 8, 2024 (1).xlsx2024-03-19 00:37 275K 
[ ]TI Semiconductor Forecast - March 8, 2024.xlsx2024-03-19 00:37 275K 
[ ]A Journey of Embedded and Cyber-Physical Systems.epub2024-03-16 07:15 14M 
[ ]A Journey of Embedded and Cyber-Physical Systems.pdf2024-03-16 05:02 4.9M 
[ ]Exec Sync Passdown March 12 2024.pptx2024-03-15 03:56 28M 
[ ]cachelet.pptx2024-03-12 06:59 346K 
[ ]air-shuttle-flight-schedule (1).xlsx2024-03-12 05:57 25K 
[ ]TR-20230620152301412.pdf2024-03-09 02:03 210K 
[ ]Roadmap for phase change materials in photonics and beyond.pdf2024-03-08 13:33 6.9M 
[ ]s41586-021-03202-1.pdf2024-03-08 04:51 3.1M 
[ ]d41586-021-00488-z.pdf2024-03-08 04:45 168K 
[ ]s41467-019-12196-4.pdf2024-03-08 04:40 2.4M 
[ ]s43074-022-00070-4.pdf2024-03-08 04:37 4.9M 
[ ]micromachines-14-01259.pdf2024-03-08 04:35 5.4M 
[ ]idf_template.docx2024-03-07 05:04 27K 
[ ]aurora-committee-training-guide-note (1).pdf2024-03-07 02:57 1.3M 
[ ]aurora-committee-training-guide-note.pdf2024-03-07 02:51 1.3M 
[IMG]Gemini_Generated_Image 8.jpeg2024-03-05 09:17 325K 
[ ]24WW09 Guest Speaker Victor Moroz -CMOS technology for the next decade.pdf2024-02-29 00:38 4.2M 
[TXT]FTE Pathfinding Project Review_ Guest Speaker Victor Moroz.vtt2024-02-28 13:54 141K 
[ ]FTE Pathfinding Project Review_ Guest Speaker Victor Moroz.docx2024-02-28 13:54 746K 
[ ]air-shuttle-flight-schedule.xlsx2024-02-28 08:50 481K 
[TXT]H1 Exec Sync FTF.ics2024-02-28 05:55 320  
[ ]s11227-024-05943-y.pdf2024-02-27 00:53 2.9M 
[ ]The_CiS2CiS2_a_new_metric_for_performance_and_ener (1).pdf2024-02-22 14:22 2.1M 
[ ]The_CiS2CiS2_a_new_metric_for_performance_and_ener.pdf2024-02-22 14:22 2.1M 
[ ]7-086-17_Vasques.pdf2024-02-22 14:20 544K 
[ ]Data_Center_Energy_Consumption_Modeling_A_Survey.pdf2024-02-22 14:09 15M 
[ ]APC-36-APC200091.pdf2024-02-22 13:28 646K 
[ ]energies-14-00376.pdf2024-02-22 13:23 2.1M 
[ ]VR tile 00 dk.pptx2024-02-17 03:16 101K 
[ ]ectc23 on advanced fanout package.pptx2024-02-15 02:57 4.5M 
[ ]change for last page.pptx2024-02-14 16:31 291K 
[ ]From_Circuits_to_SoC_Processors_Arithmetic_Approxi.pdf2024-02-14 11:58 6.8M 
[ ]MemDiskPrice-XL2010.xlsx2024-02-14 09:54 167K 
[ ]Andy_Wei__11886084__-_Process_Integration_Development_Eng_Manager_reviewed_by_Compensation_Review__2024_Annual_Rewards_Cycle__Non-Executive__2024_01_31.pdf2024-02-13 02:06 82K 
[ ]Dany_Ly-Gagnon__11407181__-_Process_Technology_Design_Engineer_reviewed_by_Compensation_Review__2024_Annual_Rewards_Cycle__Non-Executive__2024_01_31.pdf2024-02-13 01:51 82K 
[ ]Sample Rewards Statement 2024.pdf2024-02-13 01:44 335K 
[ ]Communicating Ratings and Rewards Preparation Template.pdf2024-02-13 01:44 224K 
[ ]CV_Seiyon Kim_2024.docx2024-02-02 16:07 2.9M 
[ ]Open Infrastructure Platforms to usher in age of GenAI - presented by Meta.pdf2024-02-02 06:46 15M 
[ ]Fleming_Prework.pdf2024-02-02 05:30 289K 
[ ]Sridhar Krishna Jan 2024U.docx2024-01-30 07:34 36K 
[ ]HOTI 2023 Proceedings.zip2024-01-30 00:46 12M 
[ ]d2_paper_session_D_perf_char_llm.pdf2024-01-30 00:40 1.6M 
[ ]d2_paper_session_D_domain_spec.pdf2024-01-30 00:40 2.5M 
[ ]d2_paper_session_C_battle_bf.pdf2024-01-30 00:39 1.0M 
[ ]d2_paper_session_C_charac_lossy.pdf2024-01-30 00:38 2.2M 
[ ]Nutanix_sponsor_talk.pdf2024-01-30 00:38 2.8M 
[ ]Arista_sponsor_talk.pdf2024-01-30 00:37 8.2M 
[ ]lightmatter_keynote.pdf2024-01-30 00:36 11M 
[ ]HOTI23-Keynote-Hormuth-Metz_Final.pdf2024-01-30 00:36 3.5M 
[ ]d1_paper_session_B_in_network_collectives.pdf2024-01-30 00:34 1.3M 
[ ]d1_paper_session_B_in_network_comp.pdf2024-01-30 00:33 683K 
[ ]Huawei_sponsor_talk.pdf2024-01-30 00:30 2.0M 
[ ]d1_paper_session_A_pipelined.pdf2024-01-30 00:30 1.0M 
[ ]d1_paper_session_A_ucie.pdf2024-01-30 00:28 2.3M 
[ ]IMW2022_tutorial_final.pdf2024-01-19 05:19 35M 
[ ]s40820-023-01289-x.pdf2024-01-18 07:15 12M 
[ ]YINTR23340-Status_of_the_Advanced_Packaging_2023 (1).pdf2024-01-17 07:00 15M 
[ ]YINTR23322-Fan-Out_Packaging_2023.pdf2024-01-17 06:59 11M 
[ ]europat-2023-status-of-the-advanced-packaging-business-gpe.pdf2024-01-17 06:57 926K 
[ ]IMDG_product_brochure.pdf2024-01-06 05:36 420K 
[ ]multicolor-rectangle-with-capital-lettering-in-places.webp2024-01-05 09:30 101K 
[ ]a-blue-square-containing-a-multicolored-rectangle-with-thin-horizontal-bars.webp2024-01-05 09:27 60K 
[ ]a-slice-of-mi300-stack-from-the-carrier-silicon-at-the-top-to-the-solder-ball-at-the-bottom-of-the-package.webp2024-01-05 09:26 59K 
[ ]IEDM Panel Presentation FINAL2.pdf2024-01-03 06:45 2.9M 
[ ]hpc-datasheet-sc23-h200-datasheet-3002446.pdf2024-01-03 04:57 469K 
[ ]~$639a99f3-b6a9-4602-b921-541563c40547.ppt2023-10-05 05:39 165  
[DIR]hoti23_files/2023-08-02 12:49 -  
[ ]~$20230209163710104157796_en.xlsx2023-04-25 16:39 165  
[ ]~$1fbd1e17-1c22-41ed-b087-6831d635a518.pptx2023-03-28 14:10 165  
[ ]~$20230225 - N2 WG material product decomposition v3.pptx2023-03-01 02:58 165  
[ ]~$20230217 - Alt Pkg Size for PTL_NVL.xlsx2023-02-25 07:48 165  
[ ]~$Lab Request Template n process Rev2 2016_4.pptx2022-05-05 05:13 165  
[ ]~$Book2.xlsx2022-01-13 14:50 165  
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