Index of /h96max/pn63/Downloads-1/technology/Memory /Cube/TMC

[ICO]NameLast modifiedSizeDescription

[PARENTDIR]Parent Directory  -  
[   ]64GB TMC mockup.pptx2024-06-17 07:55 619K 
[   ]AF5223-US Declaration.pdf2024-10-01 00:55 148K 
[   ]AF5223-US_Assignment.pdf2024-10-01 01:00 123K 
[   ]AF5223-US assigment.pdf2024-10-02 16:45 119K 
[DIR]Apple R1/2025-07-03 10:44 -  
[   ]AutoSave_Module for 16 Tiers.skp2024-06-29 07:50 2.6M 
[   ]AutoSave_TMC 2-tier.skp2024-06-29 02:06 2.5M 
[   ]AutoSave_TMC 2-tier_1.skp2024-06-29 11:25 2.5M 
[   ]AutoSave_TMC 16-Tier.skp2024-06-29 04:58 2.3M 
[   ]Copy of Derchang Kau - Compent cost V2.xlsx2024-07-02 10:47 44K 
[   ]Derchang- LPW Cost estimate V3-1.xlsx2024-07-16 11:50 52K 
[   ]Derchang- LPW Cost estimate V3.xlsx2024-07-16 11:49 52K 
[   ]Derchang Kau - Compent cost.xlsx2024-06-06 05:52 38K 
[   ]Derchang Kau - Component cost.xlsx2024-06-26 12:56 42K 
[   ]IMS24 Abstract - Terraced Memory Cube.docx2024-07-13 04:50 313K 
[   ]IMS scratchpad.pptx2024-07-12 07:49 711K 
[   ]Intel GPU Memory Needs.pptx2024-07-27 00:36 466K 
[   ]Intro to TMC - Q3-24 for Intel Product.pptx2024-07-23 02:54 1.5M 
[   ]Intro to TMC - Q3-24 for Intel Product Rev WW29 .pptx2024-07-20 13:20 1.0M 
[   ]LPW Bump Map mockup.xlsx2024-07-01 12:34 19K 
[DIR]LPW and propsoals from Tier-1 suppliers/2025-07-03 10:44 -  
[   ]LPW inquiries and asks.xlsx2024-09-23 05:54 11K 
[   ]MIO-Cost Model Q2'24.xlsx2024-05-31 08:10 115K 
[   ]Module for 16 Tiers.skp2024-06-29 12:00 2.5M 
[   ]Options in TMC.pptx2024-09-20 00:47 4.0M 
[DIR]SKP V7/2025-07-03 10:44 -  
[DIR]Samsung LPW/2025-07-03 10:44 -  
[   ]TMC - Exploration and Beyond.pptx2024-10-25 17:17 5.3M 
[   ]TMC 2-, 4-, 8-tier.skp2024-06-24 16:28 2.6M 
[   ]TMC 2-tier.skp2024-06-24 05:42 2.5M 
[   ]TMC 2-tier~.skp2024-06-24 05:16 2.5M 
[   ]TMC 4-tier.skp2024-06-24 06:03 2.5M 
[   ]TMC 8-Tier.pptx2024-06-25 04:26 26M 
[VID]TMC 8-tier.mp42024-07-01 02:55 46M 
[   ]TMC 8-tier.skp2024-07-01 03:47 1.0M 
[   ]TMC 8-tier~.skp2024-06-25 04:37 2.7M 
[VID]TMC 16-Tier.mp42024-06-29 13:21 56M 
[   ]TMC 16-Tier.skp2024-06-29 12:41 2.6M 
[VID]TMC 16-Tier no guide.mp42024-06-29 14:23 78M 
[   ]TMC 16-Tier~.skp2024-06-29 12:30 2.6M 
[   ]TMC Base Model.skp2024-06-24 04:45 4.2M 
[   ]TMC Base Model~.skp2024-06-24 04:40 4.2M 
[   ]TMC Focus Team Phase II.pptx2024-07-13 06:44 297K 
[   ]TMC Q2-24 Process and Cost.pptx2024-07-02 10:25 160M 
[   ]TMC Q2-24 Rollup Summary.pptx2024-10-02 07:46 164M 
[   ]TMC_molded_wire_interconnect_2024_06_24.docx2024-07-01 08:57 119K 
[   ]TMC for AI-PC Aug-16-2024.pptx2024-09-12 06:30 3.6M 
[   ]TMC for AI-PC Sep 2024.pptx2024-09-27 00:38 4.1M 
[   ]TMC for DC GPU Aug-14-2024.pptx2024-09-07 07:05 4.1M 
[   ]TMC to displace HBM.pptx2024-07-12 09:24 32M 
[   ]TSV Componet Inventory.xlsx2024-06-29 11:44 24K 
[VID]Terraced Chiplet Cubing.mp42024-07-01 03:43 78M 
[   ]Wrapping up TMC Phase II.pptx2024-10-24 14:55 4.0M 
[VID]film_countdown.mp42024-07-01 03:05 8.8M 

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