Index of /h96max/pn63/Downloads-1/technology/3D

	Name	Last modified	Size	Description
	Parent Directory		-
	2018 IFF Packaging 07 Mahajan.pptx	2018-11-02 11:28	15M
	Coop March 20 3DIC rev9_compressed.pptx	2021-04-17 12:58	13M
	3D HBM stack on XPU for Al F 1203 -pm.pptx	2021-12-04 08:36	13M
	Process Options and Risk Assessment - Q4'18 - prashant m.pptx	2021-08-10 13:08	10M
	ISSCC2021-1_Plenary_TSMC CEO.pdf	2021-04-17 12:57	7.7M
	3DIC Ext Prod Landscape ww39 v2 pm_sm.pdf	2021-10-13 06:28	6.8M
	Coop July 21 2020 3DIC TDBU FINAL r0.pptx	2021-04-17 12:57	3.5M
	Xian Powerchip DRAM logic HB IEDM 2020.pdf	2021-04-17 12:56	1.8M
	thl4paper1591390799657.pdf	2021-04-17 12:57	1.1M
	Winbond 3DIC DRAM for Intel_20201225.pdf	2021-04-17 12:56	729K
	Working sheets in building Ingredients.xlsx	2022-01-07 09:45	424K
	ODI.pptx	2020-12-17 00:51	274K
	via in one steve morien.pptx	2023-11-28 02:57	203K
	Picture (Device Independent Bitmap)	2021-04-17 12:57	69K
	wire bond.xlsx	2021-08-13 13:34	11K
	TSV types.xlsx	2021-10-26 04:08	10K
	bump related interfaces/	2025-07-03 10:43	-
	VFO/	2025-07-03 10:43	-
	Thermal/	2025-07-03 10:43	-
	Prashant/	2025-07-03 10:43	-
	From Tohoku U/	2025-07-03 10:43	-
	2.xD/	2025-07-03 10:43	-