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| Name | Last modified | Size | Description |
|---|---|---|---|---|
| Parent Directory | - | ||
| 221007_Advanced PKG Discussion_r2_intel.pptx | 2024-01-27 04:06 | 1.2M | |
| 20210520_SK hynix active interposer update_ DRAM_updated_f.pdf | 2021-08-13 15:35 | 760K | |
| 20210615_SK hynix active interposer update_ DRAM_rev.2.pdf | 2021-09-07 07:43 | 1.1M | |
| 20210804_SK hynix active interposer update_ DRAM_r4.pdf | 2021-09-03 04:36 | 1.8M | |
| AP Memory/ | 2025-07-03 10:45 | - | |
| Berton_20210726_CUBE_Intel.pptx | 2021-08-13 12:49 | 1.7M | |
| Comparison of ADM-LLC DRAM-HBM SG_Feb6_2023.xlsx | 2023-06-26 14:15 | 783K | |
| Disaggregation/ | 2025-07-03 10:45 | - | |
| Intel-SamsungTCM Exec Meeting_v0p94[1].pptx | 2021-11-03 04:35 | 3.1M | |
| SKH TCD Intel Server specs.pptx | 2021-08-13 12:49 | 267K | |
| SeDRAM Paper from Xian UniIC Semiconductor.eml | 2021-11-30 11:43 | 2.0M | |
| Winbond 3DIC DRAM for Intel_20210330.pdf | 2021-09-03 04:37 | 682K | |